ALPHA® OM-358 Solder Paste, 500 gram jar AP244604 244604

SAC305 OM358 88.2-4-M13 500GM 244604

$152.00

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Part Number SAC305-OM358-88-2-4-M13-500GM Category Tag

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  • KR

Product description:

ALPHA OM-358 is a lead-free, zero-halogen, no-clean solder paste designed to provide ultra-low voiding performance on all component types including bottom termination components. This paste achieves IPC7095 Class III voiding on BGA components and less than 10% voiding on bottom termination components and is designed for ultra-low voiding performance in high reliability alloys such as Innolot as well as traditional SAC alloys ALPHA® OM-358 Solder Paste, 500 gram jar AP244604 244604

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