Dow Corning DOWSIL EI-2888 Primerless Silicone Encapsulant Part A is a clear, high-performance material designed for protecting and encapsulating sensitive electronic components. This primerless formulation offers excellent adhesion to a wide range of substrates, along with outstanding thermal stability, flexibility, and resistance to moisture and environmental stress. Supplied in a 19 kg pail, it is ideal for industrial applications requiring reliable long-term protection.