Dow Corning DOWSIL EI-2888 Primerless Silicone Encapsulant Part B is the complementary curing component designed to be used with Part A for forming a durable, high-performance encapsulation system. This clear silicone material provides excellent flexibility, thermal stability, and resistance to moisture and harsh environmental conditions. Supplied in a 19 kg pail, it is ideal for industrial applications requiring reliable protection of electronic assemblies.