Loctite 3563 Epoxy Chipbonder Adhesive Capillary Flow 10cc Syringe
In stock
Brand Loctite
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Hazardous Material
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Temperature Controlled
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Product description:
Loctite 3563 is a rapid curing, fast flowing, liquid epoxy designed for use as a capillary flow underfill for packaged ICs, such as CSPs and BGAs. Its rheology is designed to allow it to penetrate gaps as small as 25 µm. When fully cured, it minimizes induced stress at solder joint and thus improves thermal cycling performance.
