Resinlab EP965 Epoxy Encapsulant Part B is a clear, high-performance resin packaged in a 1-quart can. It is designed for use as part of a two-component system that provides strong encapsulation and protection for electronic assemblies, components, and other applications requiring durability and chemical resistance. The material cures to form a tough, transparent finish that safeguards against moisture, mechanical stress, and environmental factors while maintaining clarity and stability.