ALPHA OM-550 is a low temperature chemistry paired with the ALPHA HRL1 alloy. This alloy was designed to exhibit improved drop shock and thermal cycling performance versus existing low temperature alloys. Together, the flux and alloy blend to make a product that has the characteristics of a modern solder paste designed for motherboards but with the ability to reflow at lower temperatures therefore minimizing NWO and HIP defects in complex assemblies. The alloy in this paste has a melting point significantly lower than SAC305.